- Vantagens de alto desempenho e processamento
- Nenhum pedido mínimo exigido
- Vendas ao vivo e suporte técnico 24 horas por dia, 7 dias por semana
- Over 10 years of Isola G200 laminate manufacturing experience
What are the application of the Isola G200 laminate?
Isola G200 pcb is suitable for
Aerospace and Defense,Automotive and Transportation,
Consumer Electronics Medical,
Industrial and Instrumentation Networking and Communication Systems.
Is Isola G200 compatible with Lead free assembly?
Yes, Isola G200 can withstand the high temperatures of soldering and reflow in montagem sem chumbo.
Atende às especificações de caracterização para montagem sem chumbo.
It ensures high temperature Tg>155 degrees Celsius, Td >330 degrees Celsius and overall CTE <3.5%.
Hence, Isola G200 meets the newer requirements of lead-free assembly.
Portanto, garantirá o bom desempenho em toda a faixa de temperaturas mais altas da solda sem chumbo.
Venture is an authorized supplier of Isola G200 in China for over 10 years. Our Isola G200 is a fully prove prepreg and laminate specifically designed to provide today’s superior reliability requirements of a printed circuit board.
Venture Isola G200 is blended with epoxy resin and bismaleimide/triazine. It helps our Isola G200 to provide high electrical, mechanical, and improved thermal performance. Our Isola G200 is perfectly suitable for any large panel size and high layer count wiring boards.
Your Leading Isola G200 Supplier in China
Venture has been in the industry of supplying Isola G200 laminates for more than 10 years. Venture Isola G200 is blended with epoxy resin and Bismaleimide/triazine. It helps our Isola G200 to provide high electrical, mechanical, and improved thermal performance.
Our Isola G200 laminates undergone high TG – 185 Degree Celcius (DSC). Meaning, our Isola G200 laminates can provide you superior performance even in a multiple thermal excursions. It can also offer you a superior thermal and chemical resistance.
Our Isola G200 is a fully prove prepreg and laminate specifically designed to provide today’s superior reliability requirements of a printed circuit board.
Aside from that, our Isola G200 has also a Low CTE from Ambient to 288 °C. It also underwent an optimized electrical insulation in high temperature and high humidity (CAF resistance).
Our Isola G200 can also provide you a consistent dimensional stability. Therefore, Venture Isola G200 offers an excellent layer-to-layer registration. Our Isola G200 is perfectly suitable for any large panel size and high layer count wiring boards.
Venture has become the most trusted manufacturer and supplier of Isola G200 throughout the decade. Whether you are a distributor or electrical engineer looking for a top-quality Isola G200 laminates, Venture can be your best manufacturer!
Venture offers you superior quality Isola G200 laminates and prepreg for your every PCB requirements. Besides, we offer reasonable cost and flexible payment terms with no minimum order required in order to support you.
At Venture, we have employed a team of professional and well-knowledged engineers. They ensure that your Isola G200 orders are fabricated through advanced processing. Therefore, you can assure that Venture’s Isola G200 are all high-quality!
If you have questions about our Isola G200, don’t hesitate to contact us!
Isola G200: The Ultimate FAQs Guide
This guide covers everything you need to know about Isola G200.
It gives you insights and explores all the fundamental aspects you need to know about this Isola PCB material.
Keep reading to be an expert in this PCB material.
- What is Isola G200?
- What are the Typical Properties of Isola G200?
- Which Resin System is Used in Isola G200?
- What are the Advantages of Isola G200?
- What the Standard Specifications of Isola G200?
- Why is Outgassing important in Isola G200?
- How do you Prepare the Inner layer of Isola G200 Laminate?
- What is the Purpose of Fillers in Isola G200?
- How do should you Handle and Store Isola G200 Prepreg and Laminate?
- How do you Determine the Stabilization Time of Isola G200 Prepreg?
- What are the Factors to Consider When Choosing Isola G200 Laminate?
- Which factors affect the Dimensional Stability of Isola G200?
- How do you Image and Etch Isola G200?
- Which are some of the Acceptable Bond Enhancements for Isola G200?
- What are the Precautions Before Lay-up of Isola G200?
- Which are the Guidelines During Baking of Isola G200?
- Which are the General Parameters for the lamination of Isola G200?
- What is the Recommended Cutting Speed and Chipload When Drilling Isola G200?
- How Does Outgassing Occur in Isola G200?
- What is the Maximum Stack Height and Hit Count of Isola G200?
- Is Permanganate effective in the Desmearing of Isola G200?
- Which is the Best Etchback Technique for Isola G200?
- How do you Achieve Complete Electroless Coverage on Isola G200?
- What are the Health and Safety Precautions When handling Isola G200?
- Which are the Quality certifications for Isola G200?
What is Isola G200?
Isola G200 is a laminate and prepreg system.
Its design fulfills the current high-reliability PCB requirements.
The PCB material features performance attributes that qualify it as an outstanding choice for broad panel size, multilayer PCBs.
What are the Typical Properties of Isola G200?
Most Isola G200 PCB materials have a thickness of 0.20mm or 0.008 inches.
They feature 2313/2116 glass construction with a 48 percent retained resin.
Here are the key thermal, electrical, and mechanical properties of Isola G200:
- Glass transition temperature (Tg) of 180 Degree Celsius
- Coeficiente de expansão térmica (CTE)
- X-axis 15 ppm/degree Celsius
- Y-axis 15 ppm/degree Celsius
- Z-axis 140 ppm/degree Celsius
- Estresse térmico
- T-260 is 20 minutes
- T288 is 8 minutes
- Permittivity (Dk) of 3.70
- Loss tangent (Df) of 0.013
Volume Resistivity (MΩ-cm)
i. After moisture resistance is 8.9 x 108
ii. At elevated temperature is 6.5 x 108
Surface Resistivity (MΩ)
i. After moisture resistance is 2.21 x 106
ii. At elevated temperature is 4.4 x 108
- Electric Strength is 45kV/mm or 1175 V/mil
- Arc Resistance is 130 Seconds
- Comparative Tracking Index is Class 3 or 175-249 Volts
Standard profile copper
i. After thermal stress is 0.96N/mm or 5.5 lb/inch
ii. After process solutions is 0.90 N/mm or 5.1 lb/inch
i. Length direction is 86.9 ksi
ii. Cross direction is 73.6 ksi
- Flammability has UL94 rating of V-0
- Moisture Absorption of 0.2 percent
Which Resin System is Used in Isola G200?
During manufacturing of Isola G200, you need BT/Epoxy blend resin systems.
This material gives the laminate improved electrical, mechanical and thermal performance.
Bismaleimide triazine resin system incorporates cyanate ester comprising of bismaleimide and triazine.
It has a modestly higher glass transition temperature than HTFR-4.
BT provides the intermediary benefit of better electrical and thermo-mechanical features than epoxies.
At the same time, it guarantees cost benefits than CE and PI.
It is the most ideal rein system for laminates applied in plastic ball grid array packages.
What are the Advantages of Isola G200?
Here are the key benefits of Isola PCB laminate Material:
- High Glass Transition temperature (Tg) of 180 degrees Celsius. Therefore, ensures excellent performance by multiple thermal excursions.
- Superior thermal and chemical resistance
- Low Coefficient of Thermal Expansion (CTE)
- Exceptional electrical insulation in high temperature and humidity (CAF Resistance)
- Very regular dimensional stability, which guarantees outstanding layer-to-layer registration.
What the Standard Specifications of Isola G200?
Isola G200 laminate and pré-impregnado is available in the following standard specifications:
i. Thickness:05mm (0.002″) to 3.2 mm (0.125″) and come as panel or sheet
ii. Copper Foil Cladding: 1/8 to 3 oz Grade 3 (HTE)
iii. Foil: Double treat Prepregs that come as panel or roll
iv. Glass Styles: 7628, 2313, 2116, 1652, 1080 e 106
Why is Outgassing important in Isola G200?
Outgassing is also referred to as off-gassing.
It is common for applications that require high vacuum conditions.
This basically implies the releasing of gas confined within a PCB laminate material.
Outgassing can affect a broad variety of applications in electronic equipment including medical equipment, satellites and other space-based equipment.
With space-based devices, the released gas can precipitate on parts such as camera lenses, making them inoperative.
Besides, medical equipment must avoid the use of PCB laminates that can experience outgassing to sustain a sterile environment.
Though unpreventable in certain applications, you must avoid or mitigate outgassing in Isola laminates to guarantee a functional end product.
How do you Prepare the Inner layer of Isola G200 Laminate?
In most cases, Isola G200 laminates usually come fully cured.
They are all set for processing.
The high-performance Isola laminate does not require stress easing bake cycles.
Therefore, it is advisable to characterize the movement of unbaked Isola G200 laminate.
Use suitable artwork compensation factors.
What is the Purpose of Fillers in Isola G200?
Commonly referred to as reinforcement, fillers enables you to adjust and enhance the essential properties of the laminate resin.
Thermosetting resin systems like those applied in Isola G200 laminates and prepregs have a tendency to shrink on curing.
The shrinkages lead to built-in stresses.
So, the copper foil and glass reinforcement hold the shrinking resin in place.
Besides, the resin system tends to ease stresses when you eventually etch the copper away.
This can cause dimensional modifications in the Isola laminate.
Consequently, resulting in warpage, misregistration, and other unwanted issues.
Therefore, using fillers can help you mitigate post-etching shrinkage and ensure a more predictable and controllable registration.
Fillers minimize the expansion of resin in all directions, but particularly the Z-direction.
The fiberglass reinforcement in most Isola G200 laminates restricts the X-Y movement.
Hence the resin shift in the Z-direction.
Since filled resin systems expand less, this helps reduce enlargement in all directions.
Moreover, you can as well use fillers to improve the thermal conductivity of a laminate resin system.
PCB laminate fillers like boron nitride and hydrated alumina feature a high coefficient of thermal transfer.
Highly filled Isola laminates can feature higher Tc in comparison to those of unfilled glass-reinforced laminates.
Furthermore, fillers can equally enhance the quality of laminate drilling and minimize resin fracturing at drilled holes.
This reduces wicking and other flaws that cause concern when performing wet processing and plating.
You substantially reduce cracking of the resin system during:
- Drilling or,
- Handling by dispersing finely divided filler within the system
The laminate filler stops the crack, substantially increasing the effective surface area.
This leads to minimized pressure and stops the propagation of the crack.
How do should you Handle and Store Isola G200 Prepreg and Laminate?
Handling and storage have significant effects on the required performance of the Isola G200 laminate and prepreg.
Remember, the Isola G200 prepreg is a fiberglass fabric impregnated using a low volatile, and partly polymerized resin.
The applied resin system is tack-free though modestly brittle.
Many lamination issues occur due to loss of resin from the fabric or woven glass damage because of incorrect handling.
The fabric used in the Isola G200 prepreg supplies the needed thickness.
Often, the quantity of resin held by the fabric rises with decreasing fabric thickness.
· Handling Recommendations
You should wear clean gloves while handling all types of Isola laminates and prepregs.
When paneling or cutting prepreg, utilize sharp, precision instruments.
Consider all prepreg as very delicate Isola PCB material.
Further, exercise extreme caution when dealing with prepregs having extremely high resin content.
Recomendações de armazenamento
Immediately after receipt, you should straightaway move all the Isola G200 laminate and prepreg to a controlled area.
Improper handling of Isola G200 prepreg will make it absorb moisture, leading to depressed glass transition temperature and cure.
This will affect the flow of prepreg in the press.
In case you need extended storage, you should reserve separate facilities having suitable environmental control.
Store the prepreg at temperatures equal to less than 21 degrees Celsius and humidity lower than 45 percent.
To avoid condensation of moisture on the prepreg, allow its packages to equilibrate to conditions of layup room before opening.
However, extended duration vacuum storage is not advisable.
You should not maintain prepreg for more than 3 months at the designated storage conditions.
Limit longer storage and always test the prepreg for functionality before using it.
Moreover, use the prepreg immediately after opening the original package.
Applying fresh desiccant, reseal the remaining prepreg in the original package.
Also, it is important that the storage environment lacks catalytic conditions such as intense UV light and high radiation levels.
How do you Determine the Stabilization Time of Isola G200 Prepreg?
The stabilization period of Isola prepreg will rely on storage temperature.
Retain the G200 prepreg inside the original sealed package during the stabilization period if the storage temperature is substantially below room temperature.
Doing this helps you avoid condensation of moisture.
What are the Factors to Consider When Choosing Isola G200 Laminate?
The type of PCB laminate you choose considerably dictates the final product’s structural strength.
Therefore, you should consider the following factors when selecting an Isola G200 PCB laminate:
- The laminate chosen needs to be easily accessible in a broad variety of specifications.
- Unless demanded by the PCB design, avoid utilizing special Isola laminates. They can be very expensive and will require longer lead times.
- Compare the Isola G200 laminate against various variables.
These consist of trouble-free processing, machinability, and costs of processing.
Select the most suitable PCB material based on your requirements and budget.
- Choose a laminate capable of withstanding the rigorous operational stress and manufacturing process.
Which factors affect the Dimensional Stability of Isola G200?
The overall dimensional movement of Isola G200 laminate is due to shrinkage.
By releasing stress from the Isola PCB laminate, it will definitely shrink.
Besides, the high-performance resin system also contributes to the shrinkage.
You will observe a great extent of the movement in the direction of the grain of the Isola PCB laminate.
There are circumstances known to modify the shrinkage proportion in grain against fill direction.
These comprise of autoclave compression and cross-plying the grain direction of Isola G200 laminate to that of prepreg.
Although these activities have their benefits, you must characterize the laminate material movement.
High performance Isola PCB laminates exhibit greater dimensional movement compared to epoxies.
How do you Image and Etch Isola G200?
Standard aqueous dry films are sufficient for imaging Isola G200 laminates.
The films ensure compatibility with both ammoniacal and cupric chloride etchants.
The copper surface of the laminate serves a key role in the yield or success of the process during image transfer.
You must carefully check the surface for drilling burns, pits, and any other form of irregularities.
In case of any flaws, stop the image transfer process and do away with the defective material straightaway.
Therefore, for successful image transfer, clean the copper surface before the application of resist.
Which are some of the Acceptable Bond Enhancements for Isola G200?
Here are the key types of bond enhancements you can use to ensure sufficient bonding of Isola G200 laminate:
- Post Reduced Oxides
- Oxide Alternatives
- Double Treat Copper
The performance and bond strength of reduced oxides might rely on the maximum temperature attained during Isola G200 pressing.
This relies on the oxide used.
Temperatures should not surpass 180 degrees Celsius when pressing G200 laminate with reduced oxides.
What are the Precautions Before Lay-up of Isola G200?
In case the Isola G200 prepreg absorbed moisture during storage, you need to condition it before lay-up.
Dry environments like vacuum chambering or other techniques of reducing residual moisture will enhance the prepreg flow consistency.
Reducing moisture content also ensures higher glass transition temperatures and boost properties of the Isola G200.
For that matter, you should carefully bake layers before lay-up to remove moisture.
The acceptable bake cycles for Isola G200 laminate range from 93 to 121 degrees Celsius for 30 to 60 minutes.
Moreover, layers lamination should be within 4 hours after baking.
If not so, re-bake or store in a vacuum/dry environment.
Consult your chemical supplier on post oxide baking procedures in which you have used reduced oxides in the Isola laminate.
This is because excessive baking might result in reduced pink ink resistance.
It is advisable to perform post oxide baking in vertical racks.
You should have panels of Isola G200 laminate supported in a vertical position.
Which are the Guidelines During Baking of Isola G200?
Always ensure that the baking oven temperature is lower than the maximum operating temperature and Tg of the Isola laminate.
Nevertheless, you must set the temperature above 100 degrees Celsius.
Select the baking time based on:
- Established moisture content
- Required content
- Overall thickness
- PCB laminate complexity
It is advisable to perform the Isola laminate baking inside a forced-air recycling oven.
However, you can as well use nitrogen or vacuum atmospheres effectively.
For proper circulation, ensure the:
- Oven is clean
- There is appropriate venting
- You have adequate gaps between the Isola G200 laminates
You should never stack the PCB laminates within the baking oven.
Moreover, the purpose of the oven used should be solely for baking only.
Using the Isola laminate baking oven can result in surface finish flaws and cross-contamination.
This is due to the deposition of residues from other operations in the oven.
They may eventually deposit on the laminates.
Furthermore, before determining a baking profile, you need to consult the Isola PCB laminate supplier.
They will help you determine the baking limits.
Testing the moisture content of the laminate is the initial step in determining a bake profile.
It is advisable to determine the Isola G200 baseline dry weight through a bake.
Subsequently, you can subject the sample to raised temperature and humidity conditions.
This is to enable it to absorb known moisture quantity.
Additionally, take the PCB laminates out of the oven at periodic intervals and measure the weight.
Doing this helps in determining the moisture loss rate at a specific bake temperature.
Record the time taken to attain the required maximum acceptable moisture content.
Always apply this bake time for succeeding baking of Isola G200 laminates.
Which are the General Parameters for the lamination of Isola G200?
To fully cure Isola G200 inside the press, you need to extend standard FR4 press cycles.
Here are some of the general recommendations for lamination pressure depending on the type of press used:
- Vacuum Time: 20 minutes (No application of pressure with laminates on risers)
- Temperatura de cura: 180 Degrees Celsius
- Tempo de cura: 90 minutos
- Resin Flow Window: 90 to 150 degrees Celsius, and you should sustain heat ramp in this range of temperature.
- Heat Ramp: 3.5 to 5.5 degrees Celsius per minute
- Pressão – 200 to 300 PSI, and you need to assess pressure requirements for every design.
- Aplicação de pressão
- Single Stage: Application of pressure comes after vacuum dwell time.
- Dual Stage: – Apply 50 PSI after vacuum dwells time, change to high pressure in less than 90 degrees Celsius Isola PCB laminate temperature.
- Queda de pressão: At cure temperature, decrease pressure to 50 PSI in the hot press after 30 minutes, though an optional step.
- Esfriar: Cool to 35 to 40 degrees Celsius with 50 PSI pressure before transferring or removing the laminates.
You should remove the Isola G200 flash by routing instead of shearing to prevent edge delamination.
What is the Recommended Cutting Speed and Chipload When Drilling Isola G200?
Successful drilling of Isola G200 laminate needs lower cutting speeds and reduced chip loads in comparison to FR-4 PCB laminates.
This is due to the fact that BT/Epoxy resin combinations are more brittle compared to Fr-4 epoxies.
In addition, they have greater drill resistance because of their higher glass transition temperature.
How Does Outgassing Occur in Isola G200?
When outgassing happens, gas trapped within the laminate releases.
It commonly takes place in two ways including:
Hand or Wave Soldering during Production
During wave or hand soldering, any traces of moisture around a through-hole transforms into vapor because of heat.
If the vapor escapes, it forms voids within the solder mask.
The voids formed within the electroless copper plating makes the Isola G200 laminate conductive.
As a result, it can cause substantial problems.
They prevent the flow of electrical current through the plating, leading to defective PCB laminates.
The Isola G200 laminate should have a uniform electroless copper layer to serve its role.
Also, the voids hinder that from happening.
Use in Ultra-high Vacuum Conditions
In PCB applications like medical facilities, laboratories, or outer space can lead to the escape of moisture from the PCB laminate.
As a result, the moisture creates condensation on parts of the equipment.
In space applications, the formed condensation due to outgassing can affect materials such as measurement tools and camera lenses.
The vapor affects measurement results and fog lenses.
Scientific laboratories and medical facilities alike should have an aseptic environment to utilize their instruments correctly.
Isola G200 off-gassing can contaminate apparatuses and the nearby environment, causing harm to patients or incorrect testing results.
What is the Maximum Stack Height and Hit Count of Isola G200?
Hit count and stack height will rely on the general thickness of Isola PCB board and construction.
You can successfully drill and stack up to 3 mm high standard 0.060” laminates.
As a general rule, the total thickness of the board in a stack must not surpass 5mm.
Moreover, the maximal hit count for Isola G200 laminate is 750 to 1000 based on the design of the board.
However, it is not advisable to use re-sharpened bits on the laminates.
Stack up PCB
Is Permanganate effective in the Desmearing of Isola G200?
There has been limited success with permanganate in eliminating Isola G200 smear.
Many PCB laminate manufacturers utilize the permanganate desmear cycle on Isola G200.
However, the users might be restricted to the elimination of hole wall fragments.
Only the most vigorous permanganate procedures will offer a desmear.
The Isola PCB laminates can move straight away into the electroless conditioner/cleaner without unfavorable impacts on the adhesion of plating.
You can guarantee this by cautiously controlling drill variables to eliminate smear.
Which is the Best Etchback Technique for Isola G200?
The most suitable etch back method for Isola G200 resin is plasma.
Regular plasma gas blends and cycles are adequate.
The process involves shooting at the laminates in pulses, a high-speed jet of glow discharge of a suitable gas mixture.
Referred to as etch species, the plasma source can be either neutral radicals/atoms or charged ions.
However, the primary problem in dry or plasma etching is developing the correct type of plasma.
You will perform the etching of the Isola PCB laminate when you create the right plasma.
Additionally, for successful plasma etching, you must ensure that the pressure chamber is set at pressure below 100 PSI.
Ionization happens only in the presence of a glow charge, with excitation initiated by an external source.
Here are the common types of plasma etching techniques:
- Inductively Coupled Plasma Etching
- Plasma Enhanced Etching
- Reactive Ion Etching
How do you Achieve Complete Electroless Coverage on Isola G200?
A prolonged dwell time inside the electroless conditioner/cleaner bath might be instrumental in achieving total electroless adhesion and coverage.
This is because of the increased resistance to chemicals of BT/Epoxy resin systems.
For that matter, it is important to consult your chemical supplier when establishing process variables for Isola G200.
What are the Health and Safety Precautions When handling Isola G200?
Always excess care when handling Isola laminate, since they have sharp edges that can lead to scratches and cuts.
Handling and machining of Isola G200 laminates and prepregs can produce dust.
For that matter, you need suitable ventilation in machining or punching sections.
Moreover, you should wear protective masks to prevent inhaling dust.
In addition, it is advisable to use safety glasses, aprons and gloves if you have prolonged or frequent eye/skin contact with dust.
Nonetheless, Isola PCB materials do not contain polybromide-biphenyl oxides or polybromidebiphenyls as flame retardants.
Which are the Quality certifications for Isola G200?
Here are the common quality certifications you should look for in an Isola G200 product:
- Certificação RoHS
- Certificação UL
- Certificação REACH
- Certificação IPC
- Certificação ISO
With this information, you can definitely choose high performance Isola G200 material.
However, in case you have any question, Venture Electronics team is here to help.
Contacte-nos agora for all your questions and inquiries about Isola G200 material.